Item No | Backing | Adhesive | Thickness 0.005 | Peel Strength kg/25mm | TensileStrength kg/25mm | Elongation % | Thermal Level | Featuresand application |
MK106 | Polyinmide film | Silicon | 0.065 | 0.8 | 13 | 50 | 300 | High temp resistance,solvent resietant.Applied to protectingPC board while spraying tin and tin stove procession. |
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